HDI PCB
High-density interconnect circuit board (HDI PCB) is an advanced type of printed circuit board (PCB) designed to accommodate higher-density circuit components.
What is HDI PCB?
High-density interconnect circuit board (HDI PCB) is an advanced type of printed circuit board (PCB) designed to accommodate higher-density circuit components. HDI PCB utilizes fine lines and micro via technology, allowing more functions to be placed on the board while taking up less space. This technology is especially important for modern high-performance electronic devices, which require smaller, faster, and more powerful circuit boards.
Construction & Technical Capabilities
Layer | Details |
Substrate Material | High-Tg FR-4, halogen-free, and specialty HDI pcb materials tailored to HDI circuit requirements. |
Copper Layers | Minimum trace/space down to 50μm/50μm, supporting advanced pcb design and higher density. |
Dielectric Layers | Thin, low-loss layers for tighter spacing, improved signal speeds, and efficiency of design. |
Via Structure | Laser-drilled microvias, stacked vias, skip vias, blind and buried vias for HDI board design. |
Surface Finish | ENIG, OSP, immersion silver, ENEPIG—ensuring soldering quality and connectivity for tiny pads. |
Key Technical Specifications:
- Max Board Size:450mm x 600mm (custom sizes for any HDI circuit board)
- Layer Count:4–20+ (multiple HDI buildup layers, ultra-HDI and hybrid high-density interconnect technology)
- Minimum Microvia Size:1mm (microvias PCB standard)
- Connection Pad Density:As high as 1200 pads/sq. in (board design with higher wiring density per unit area)
- Compliance:RoHS, UL, ISO9001, IPC-6012, IPC-2226
- Component Support:BGA, CSP, QFN, flip-chip—with via-in-pad and high connection pad density
- Testing:AOI, flying probe, and x-ray inspection for HDI PCB reliability
advantages of Aluminum PCB
Microvias, blind via, and buried vias technology allow higher wiring density per unit for more components in less space.
HDI circuit boards enable efficient interconnects for BGAs, CSPs, QFNs, and fine-pitch ICs used in HDI.
Controlled impedance, reduced crosstalk, and improved signal integrity—ideal for high-speed circuits.
Support for several HDI buildup layers, including stacked and staggered microvias, maximizing design efficiencies.
Supports different types of HDI and board designs, whether a single HDI board or a highly complex multilayer PCB.
All HDI boards undergo thorough design and testing to ensure long-term reliability in harsh and critical environments.
Types of Aluminum PCBs We Offer
- 1+N+1, 2+N+2 Stackups: Popular buildup HDI PCB structures for smartphones and high-density electronics.
- Any-Layer HDI PCB: For the highest wiring density, fully interconnected-layers with stacked microvias.
- Skip-Via/Blind & Buried Vias: Advanced designs used to increase routing density and reduce layer count.
- Ultra HDI: The ultimate in high-density interconnect for advanced PCB design and technology for the production of flagship devices.
- Prototype & Mass Production: From a single HDI board to high-volume HDI circuit board production.
