BGA PCB
With the continuous advancement of electronic technology, PCB sizes have become increasingly complex and smaller. To meet the functional requirements of these small devices, BGA is a high-density, low-cost packaging technology used in SMT assembly.
What is a BGA PCB?
Rigid-flex printed circuit board (rigid flex pcb) is a circuit board that combines the advantages of rigid circuit boards and flexible circuit boards. It not only has the excellent bendability of flexible circuit boards, but also has the tensile strength of rigid circuit boards. This makes them a popular choice for applications such as medical devices, military applications, aerospace, and smartphones. Its flexibility allows users to freely install it precisely into complex packaging geometries.
BGA PCB Construction and Technical Capabilities
Layer | Details |
Substrate Material | Choose ceramic substrate, plastic BGA, or high-TG FR-4 for expected operating conditions; customized for thermal and electrical performance. |
Copper Layers | 0.5–3 oz copper, ideal for high-power BGA chip and solder joint integrity. |
Dielectric Layer | Low-loss, controlled thickness for exceptional signal routing and heat dissipation. |
PCB Pads & Array | PCB pads are arranged in a grid pattern for the array, supporting solder balls of varied alloy and size, down to 0.3mm for micro BGA. |
Surface Finish | ENIG, OSP, Immersion Silver/Gold, Lead-Free HASL for flat, solderable finishes for all BGA package types. |
Key Technical Specifications:
- Max Board Size:Up to 400mm × 600mm (custom pcb space available)
- Layer Count:4–24 layers (pcb layout and HDI ready)
- Minimum Trace/Space:50μm / 50μm (enabling fine-pitch/)
- BGA Pad Pitch Supported:3mm (smaller for micro BGAand tape BGA)
- Surface Finish Options:ENIG, OSP, Immersion Silver/Gold, Lead-Free HASL, optimized for bga solder
- Compliance:RoHS, UL, ISO9001, IPC-6012/6013/7095
- BGA Soldering Process:Reflow soldering, vapor phase, and custom rework station guidelines
Types of Ball Grid Array PCBs We Offer
Standard Ball Grid Array PCB
Rigid, multi-layer, and cost-effective, suitable for a range of bga package types and electronic device form factors.
Fine-Pitch BGA / Micro BGA PCB
For grid arrays with minimal pcb space and dense IC mounting.
HDI and PoP BGA PCB
PCB production for package on package and stacked die, ideal for mobile and processor modules.
Ceramic and Plastic BGA PCB
Ceramic bga for rugged/thin ic packages; plastic bga for cost and weight-sensitive applications.
Tape BGA
For specialized mobile, automotive, and miniaturized applications.
Advantages of BGA PCB
BGA technology facilitates the miniaturization of integrated circuits with hundreds of pins, taking up less space on custom PCBs while improving electrical efficiency and making better use of space.
BGA packages feature uniformly dispersed solder balls on their bottom surface and large contact areas between PCB and package, which allows most of the heat to move downward through it and dissipate, thus improving heat conduction and dissipation performance. Effective heat dissipation helps lower component temperature levels to prevent overheating that reduces its lifespan over time.
As the distance between wires decreases, the inductance also decreases. Due to the smaller spacing, the lead inductance of the GBA package and the PCB board is lower, while also preventing the pins from breaking or bending and providing sufficient stability, thereby achieving better electrical performance than leaded devices.
BGA leads are made of solder balls, which have high solder joint strength and uniform stress distribution. Therefore, the possibility of PCB damage is greatly reduced during use.
Efficient use of PCB space saves materials, while high thermal and electrical performance ensures that electronic components are not easily damaged during use.
Common applications of BGA PCBs
Computers and Servers: Because GBA PCB has good thermal conductivity, it is used in high-performance devices such as CPU, GPU and chipset. It perfectly solves the problem of performance degradation caused by the large amount of heat generated by the chip during operation.
Consumer Electronics: Due to market demand, consumer electronics are becoming smaller and smaller. In order to reduce the size without affecting the performance, GBA is widely used in consumer electronic devices due to its small size and high performance.
Automotive Electronics: The vehicle often vibrates and is unstable during operation. GBA has a stable structure and is reliable and heat-resistant. It is very suitable for vehicle computing platforms and ADAS control systems.
Communication Equipment: GBA PCBs can transmit signals at high speeds and provide stable connections. They are widely used in routers, switches, and optical communication systems.
Why choose Lingkey to cooperate
PCB manufacturing, fast response
We have extensive experience and are equipped with state-of-the-art equipment for PCB manufacturing and assembly. We can handle all types of BGAs and are able to mount BGAs with a minimum pitch of 0.4mm onto your PCB.
Comprehensive testing and quality assurance
The factory is equipped with testing systems such as flying probe testers, AOI, X-ray, and functional testing, ensuring full-process quality control.
Quality Assurance
We have obtained certifications such as ISO 14001, UL, and ISO 9001, fully meeting the strict quality standards required for medical, automotive, and industrial control applications.
